Electroless copper plating solution

Abstract

Abstract PURPOSE: To improve the stability of an electroless copper plating soln. while enhancing the deposition speed and the characteristics of a film by spacifying the stabilizing agent, the cupric ion complexing agent and the cuprous ion complexing agent in the composition of the plating soln. CONSTITUTION: This electroless copper plating soln. is prepared by blending water with water-soluble copper salt, a reducing agent, a pH regulator, ≥1 kinds of nonionic polyoxyalkyleneamine surfactants represented by formula I, etc. as a stabilizer, ≥1 kinds of cupric ion complexing agents having amine, carboxylic acid and OH groups and represented by formula II, etc. and ≥1 kinds of cuprous ion complexing agents represented by formula III (where X is -N-, X' is -NH- or the like and R is -(CH 2 ) 2 -, -CH=CH-, -N=N- or the like). By this composition the plating speed and the physical and mechanical properties of a plated film are enhanced, and the stability of the plating soln. is improved. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Osamu Miyazawa
• 👤 Hitoshi Oka
• 👤 Ataru Yokono
• 👤 Tokio Isogai
• 👤 Isamu Tanaka
• 👤 Akira Matsuo
• 👤 Yoshio Nakagawa

Bibliographic Details