Mounting structure of semiconductor

Abstract

Abstract PURPOSE:To improve the reliability of mounting according to a face-down system, and to enable automation by fastening a photosensitive heatproof film, to a bonding section thereof a small hole is formed, onto a circuit substrate and positioning a bump electrode of an element at the small hole and joining the electrode. CONSTITUTION:A connection pattern 5 is shaped to the circuit substrate 4, the photosensitive heatproof film 3 is laminated and exposed and developed, and the small holes 3a are formed where corresponding to the solder bumps 1a of an IC 1. The film 3 is cured in order to improve adhesive property between the substrate 4 and the film 3, the bumps 1a are positioned into the small holes 3a and the IC1 is loaded, and the bumps 1a and the pattern 5 are connected electrically through soldering by means of a reflow oven. Since the film 3 is formed in this manner, the flow of solder can be prevented, and mounting can be miniaturized and its reliability can be improved while the IC is easily positioned. Accordingly, automation is enabled.

Inventors

• 👤 Tetsuo Sato
• 👤 Katsuji Komatsu
• 👤 Kazuo Inoue
• 👤 Makoto Koshikawa
• 👤 Noriyuki Kasama

Bibliographic Details