JPS5793535A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1980-12-03
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Granted: —
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Expires: 2000-12-03
Abstract
Abstract PURPOSE:To increase the securing strength of a semiconductor pellet by forming a chemical nickel plating layer on the surface secured with the pellet and securing a lead frame through a solder. CONSTITUTION:A pellet 14 is secured through a solder 17 onto the tab 12 of a lead frame. A chemical nickel plating layer 19 is merely formed at the side secured with the pellet 14. Thus, it can eliminate the metal such as expensive Au, can provide good wettability with the solder, and the securing of the tab to the pellet can be rigidly performed.
Inventors
- 👤 Hiromichi Suzuki
- 👤 Susumu Okikawa
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 05:53
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/50; H10W72/531; H10W72/5363; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
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