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JPS5788944A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method for mounting sensor

Assignee: Aisin Takaoka Co Ltd
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Filing: 1980-11-22
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Granted: —
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Expires: 2000-11-22
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Abstract

Abstract PURPOSE: To fix a sensor surely to a mold without requiring piercing of the mold or the use of adhesives by mounting the sensor removably in the prescribed position in the surface of the mold than performing molding. CONSTITUTION: In the case of mounting a sensor to, for example, a cope, first the surface of a pattern 1 is pierced in a perpendicular direction, and the leading end part of a sensor 2 is inserted freely removably, or a part of the leading end of the sensor 2 is stuck along the pattern 1 by means of a adhesion tape. In this way, the pattern 1 and the sensor 2 are made removable at the stage of rapping. Next, a molding flask 3 is superposed on the pattern 1, and molding sand is compacted to form a mold 4. In the case of a green sand mold, the mold is immediately rapped, and in the case of a curable mold, the mold 4 is rapped after curing treatment. In this way, the mold 4 mounted with the sensor 2 is obtained. COPYRIGHT: (C)1982,JPO&Japio

Inventors

  • 👤 Motokuni Doi
  • 👤 Koji Tatematsu

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 18:40
CPC Classifications
—

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