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JPS5787409A Expired / Lapsed JP ⏱️ 0.0 years remaining

Photo-setting resin composition

Assignee: Resonac Corp
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Filing: 1980-11-20
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Granted: —
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Expires: 2000-11-20
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Abstract

Abstract PURPOSE: To prepare the titled composition giving a coating film having excellent adhesivity and surface hardness, by compounding a polymer having (meth) acryloyl group and α,β-unsaturated dibasic acid residue, a compound having a specific structure, an epoxy compound and a photo-polymerization initiator. CONSTITUTION: The objective composition is prepared by compounding (A) pref. 30W90pts.(wt.) of a polymer having (meth)acryloyl group and/or α,β-unsaturated dibasic acid residue (e.g. epoxy acrylate), (B) pref. 5W50pts. of a compound of formula (R 1 is H or CH 3 ; X is alkylene; n is 0W2) having tricyclodecenyl group and (meth)acryloyl group (e.g. tricyclo[5,2,1,0 2 , 6 ]decenyl acrylate), (C) pref. 5W30pts. of an epoxy compound such as an epoxy resin derived from bisphenol A and epichlorohydrin, and (D) 0.1W20pts. of a photo-polymerization initiator(e.g. benzoin). COPYRIGHT: (C)1982,JPO&Japio

Inventors

  • 👤 Akira Kageyama
  • 👤 Ikuta Terada

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 16:35
CPC Classifications
—

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