Resin composition for plating

Abstract

Abstract PURPOSE: To provide a resin composition for plating which permits application of electroplating directly by saving chemical plating by compounding respective prescribed ratios of an ethylene-propylene copolymer or the like, carbon black, sulfur and metallic powder or metallic sulfide with a thermoplastic resin. CONSTITUTION: A resin composition for plating consisting of compounding 1W 30pts.wt. an ethylene-propylene copolymer or an ethylene-propylene-diene terpolymer, 15W70pts.wt. carbon black and 1W20pts.wt. metallic powder or metallic sulfide with 100pts.wt. a thermoplastic resin (e.g.; PE). Powder of iron, zinc or the like is used for said metallic powder, and zinc sulfide, ammonium sulfide, etc. are used for the metallic sulfide, respectively. This resin composition eliminates electroless plating (chemical plating) processes completely, and permits direct electroplating. When strike nickel plating is applied on the moldings thereof, the moldings exhibit ≥2.0kg/cm plating adhesive strength within 5min/dm 2 throwing power time, and have a good appearance free from pinholes and the like. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Kazuo Hoshi
• 👤 Yoshio Nakagawa

Bibliographic Details