Hybrid integrated circuit

Abstract

Abstract PURPOSE:To prevent electric contact between a wire and a conductor, etc., of a hybrid integrated circuit by a method wherein the surface of the conductor or a resistor positioning under the bonding wire is covered with an insulating film. CONSTITUTION:The surface of the conductor 5 being in danger of coming in contact with the bonding wire 2 is covered preliminary with the insulating film 7, and formation of the insulating film thereof is performed by the screen printing method. Accordingly even when the bonding wire is made to come in contact with the conductor or the other material being unfavorable to contact, electric connection is not generated, and the high reliable hybrid integrated circuit can be obtained.

Inventors

• 👤 Masahiro Otani

Bibliographic Details