Physical vapor deposition method

Abstract

Abstract PURPOSE: To form a uniform hard film with high adhesion by cleaning the surface of a tool, each of parts or the like by sputtering with H 2 or a gaseous mixture of H 2 with an inert gas and by physically vapor-depositing a solid soln. of a hard compound on the cleaned surface. CONSTITUTION: The surface of a cutting tool, each of wear resistant parts or a decoration is cleaned by sputtering with H 2 or an atmospheric gas contg. ≥20, especially ≥50vol% H 2 . A solid soln. of a C, N or O compound of a IVa, Va or VIa group metal in the periodic table and/or ≥1 kind of compound such as Al 2 O 3 is physically vapor-deposited on the cleaned surface to form a single or multiple layer. The optimum physical vapor deposition method is an ion plating method. When the substrate is a gear cutting tool or a forming tool made of high speed steel and having a complex shape, the effect is shown especially, and the resistances to wear, melt sticking, corrosion, etc. are enhanced. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Yoshihiko Doi
• 👤 Yoshiki Maeda
• 👤 Terunori Kobayashi

Bibliographic Details