Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To avoid a short circuit phenomena caused by a conductive piece by a method wherein the part of the chip-sticking surface of a ceramic package on which a semiconductor chip is not placed is coated with thermal resistant resin after the semiconductor chip is placed. CONSTITUTION:After a chip 2 is bonded to a surface 7 for sticking a chip of a ceramic package 1, the remaining surface is coated with polyimide or thermal resistant silicon resin 8. Through the situation, even if there are small pieces that are easy to be separated on the bottom surface, since they are enclosed in the resin, short circuits of wiring can not be found afterward.

Inventors

• 👤 Teiichi Endo

Bibliographic Details