Inspection of semiconductor device

Abstract

Abstract PURPOSE:To shorten the inspection time with a simplified inspection of a wafer by connecting individual ICs to a chip having a pad concentration section, while providing a wiring and an accessory circuit in the cutting region of a wafer. CONSTITUTION:Chips 12 with a pad concentration section 10 and a plurality of IC chips 15 are arranged on a wafer 1 at a proper ratio (i.g. 1:32). Wiring blocks 13 and circuits 14 comprising resistors 22 and the like are arranged on cutting regions of the wafer 1 to connect the chips 12 with the chips 15 electrically. For example, a prober is used to feed inspection signals to each chip 15 in parallel from the pad concentration section 10 and the output signals (inspection data) of the chips 15 are recovered sequantially in series to the concentration section 10. This enables simple and quick inspection of complicated LSIs without probing of individual chips. In the case of small-lot production, ROMs and control circuits are incorporated into the chip 12, thereby the wafer can be provided with the function of inspection.

Inventors

• 👤 Hiroshi Kadota

Bibliographic Details