Preparation of thermal print head

Abstract

Abstract PURPOSE:To improve the yield rate of production of thermal heads by forming a substrate which is processed to be readily divided into plural number of area of thermal head unit, and by dividing and cutting the substrate into areas and then integrating them to a thermal head. CONSTITUTION:Two thermal head units 100A, 100B of the same composition are formed on one single substrate 100. Each of these units is composed of heat generation resistor elements 1A, 1B, reverse current prevention diodes 2A, 2B, common lead terminals 3A, 3B, multi-layer wiring units 4A, 4B and signal terminals 5A, 5B. The substrate 100 is cut along cut surfaces 11, 12. The cut surface 11 shall be positioned so that it maintains the element interval of the resistor elements 1A, 1B. The cut surface 12 is set at an intermediate position between common lead terminals 3A, 3B. The thermal head units 100A, 100B thus obtained are connected by making the cut surfaces 12 abut against each other. As a result, a thermal head having doubled capacity can be formed.

Inventors

• 👤 Akira Yabushita

Bibliographic Details