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JPS5765751A Expired / Lapsed JP ⏱️ 0.0 years remaining

Highly electrically conductive resin composition and electrically conductive resin molded product therefrom

Assignee: Toray Industries Inc
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Filing: 1980-10-08
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Granted: —
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Expires: 2000-10-08
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Abstract

Abstract PURPOSE: A highly electrically conductive resin composition, prepd. by compounding a resin with an electrically cooductive material formed by coating a core material with a metal having m.p. below the deformation temp. such as softening temp., m.p. or pyrolysis temp. of the core material. CONSTITUTION: An electrically conductive material formed by coating the surface of a core material such as glass fiber, metal fiber or copper-plated carbon fiber with a metal such as tin, lead, aluminum or solder having m.p. below the deformation temp. of the core material in a thickness about 0.2W100μ, is used. Namely, a resin such as polyethylene or epoxy resin is compound with about 5W60vol%, based on the composition to be prepd., said electrically conductive material to obtain an electrically conductive resin composition. COPYRIGHT: (C)1982,JPO&Japio

Inventors

  • 👤 Junzo Gashiro

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-30 22:35
CPC Classifications
—

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS5190338A Cited
JPS51134893A Cited
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US4216423A Cited
JPS5490596A Cited

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