Highly electrically conductive resin composition and electrically conductive resin molded product therefrom
Abstract
Abstract PURPOSE: A highly electrically conductive resin composition, prepd. by compounding a resin with an electrically cooductive material formed by coating a core material with a metal having m.p. below the deformation temp. such as softening temp., m.p. or pyrolysis temp. of the core material. CONSTITUTION: An electrically conductive material formed by coating the surface of a core material such as glass fiber, metal fiber or copper-plated carbon fiber with a metal such as tin, lead, aluminum or solder having m.p. below the deformation temp. of the core material in a thickness about 0.2W100μ, is used. Namely, a resin such as polyethylene or epoxy resin is compound with about 5W60vol%, based on the composition to be prepd., said electrically conductive material to obtain an electrically conductive resin composition. COPYRIGHT: (C)1982,JPO&Japio
Inventors
- 👤 Junzo Gashiro
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.