Tin and tin-lead alloy plating solution

Abstract

Abstract PURPOSE: To provide the titled soln. capable of forming an electrodeposited film with superior characteristics without causing no problem of environmental pollution by adding a stannous salt, gluconic acid and as surfactant. CONSTITUTION: A tin or tin-lead alloy plating soln. is prepared by adding (A) about 1W40g/l as metallic Sn of a stannous salt such as stannous chloride optionally in combination with a lead salt such as lead nitrate, (B) about 50W300g/l of ≥1 kinds of compound selected from gluconic acid, glucoheptonic acid, glucohe ptonolactone, etc. and (C) about 0.05W20g/lsurfactant such as polyoxyethylene alkyl ether. To the soln. may be added about 2W100g/l bydrazine (salt). Sutiable plating conditions are about 20W60°C bath temp. and about 0.1W6A/dm 2 cathode current density. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Masatoshi Maruta
• 👤 Takaaki Mizukami
• 👤 Kimie Tsuge

Bibliographic Details