Heat resistant cu alloy having high electric conductivity

Abstract

Abstract PURPOSE: To offer a Cu alloy excellent in electric conductivity and heat resistance for use in an electronic device, by adding specified amounts of B, P, In and/or Te into Cu. CONSTITUTION: Oxygen-free Cu is melted. 0.0005W0.01% of B and one or more of 0.001W0.01% P, 0.002W0.03% In and 0.001W0.06% Te are added into the Cu melt, to make a Cu alloy. The ingot made of the Cu alloy is hot extruded to a roughly drawn wire at 850°C, and then cold drawn to a wire material having a diameter of 2.6mm. Thus, a Cu alloy wire material, whose electric conductivity and heat resistance are requested for use as a conductive material, a commutator piece, a coiling wire or the like for an electronic device or the like, can be produced at a low cost. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Shinichi Komori
• 👤 Yasushi Shimanuki
• 👤 Isamu Suzuki

Bibliographic Details