Heat-bondable film

Abstract

Abstract PURPOSE: To provide the titled film which is made porous after heat-bonding to form an air-permeable bonded layer, by molding a resin compsn. composed of an ethylene polymer resin and a tackifying resin into a film having a specified thickness. CONSTITUTION: 1W20pts.wt. tackifying resin having a softening point of 60W140°C such as a coumarone-indene resin is blended with 100pts.wt. ethylene polymer resin having a m.p. of 80W120°C such as an ethylene-vinyl acetate resin. The resulting resin compsn. is extruded into a film having a thickness of 20W200μ by a T-die extrusion method, an inflation method, etc. EFFECT: This film has such a heat resistance that 180° peel strength is 300g/inch width or higher even in an atmosphere of 80°C. USE: Bonding of automotive trim materials, ceiling materials, furnishing materials, etc. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Ryosuke Enoshita
• 👤 Makoto Hosonuma
• 👤 Hiroshi Makiguchi
• 👤 Hisashi Sugiyama

Bibliographic Details