Production of slit masi

Abstract

Abstract PURPOSE:To reduce reflected electrons by a method wherein the center of the large hole portion of each transmittal hole is slided in the direction of an axis X (Y) against the center of the small hole portion as the inclination of a side wall far from an axis X (Y) line proceeds to a direction near the direction of the axis X (Y). CONSTITUTION:Photoresist layers are formed on either surface of a steel sheet. A small hole pattern for a slit mask is baked on one side of the steel sheet. On the other side of the steel sheet, a large hole pattern is baked in such a way that the centers of large hole portions 200-2n0, against the centers of small hole portions 300-3n0, are made to respectively slide by a gradually increasing amount in a tempo slowed gradually as, in the direction of an axis X, the inclination of a side wall in the direction of a long side and far from a Y axis line proceeds to a direction near the direction of the axis X, and in the same way that the centers of the large hole portions are made to slide by the same amount as in the case of the direction of the axis X in the direction of also an axis Y. After this, a slit mask is produced through development and etching. By so doing, electron beams are not interfered by the transmittal side wall, while halation is hardly generated.

Inventors

• 👤 Yukio Shimizu

Bibliographic Details