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JPS5756746A Expired / Lapsed JP ⏱️ 0.0 years remaining

Humidity sensitive semiconductor element

Assignee: Hitachi Ltd
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Filing: 1980-09-24
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Granted: —
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Expires: 2000-09-24
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Abstract

Abstract PURPOSE:To obtain a humidity sensitive element having a P-N joint which has a high sensitivity and a long life and also a high mass productivity, by protecting the joining part by an oxidation film and forming a metallic layer electrode and a film made of one kind or more of a specific resin on the oxidation film as a humidity sensitive protective film. CONSTITUTION:For example, a p type diffusion layer 2 is formed on an n type silicon substrate 4 and exposed portion of P-N joining of a PNP type MOS element provided with a source electrode 5, a gate electrode 6 and a drain electrode 7, is protected by an insulation film 1 such as SiO2, Si3N4. Next, a humidity sensitive protective film 3 is formed on the film 1 by using one kind or more of polyester, polyester sulfon, polyimide, polyimidoether sulfon, polyimido sulfon, polyimidoquinazoline-dione and silicone resin. Hereby, there is a relation of a straight line between the relative humidity of the humidity sensitive element and a logarithm of a leakage current and the current is increased in accordance with an elevation of the humidity. Thus, the element having a high sensitivity and a stain resistance for adsorption of dust, cigarette smoke or waste gas of a motorcar and also, a hydrolysis resistance and moreover, a long life, is obtained.

Inventors

  • 👤 Takashi Yokoyama
  • 👤 Tokuyuki Kaneshiro
  • 👤 Hiroshi Suzuki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 23:12
CPC Classifications
G; G01; G01N; G01N27/00; G01N27/26; G01N27/403; G01N27/414

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