JPS5753969A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1980-09-17
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Granted: —
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Expires: 2000-09-17
Abstract
Abstract PURPOSE:To augment mechanical combination of a lead and a resifn former by a method wherein a lead frame is provided where it is insertedly supported by a hollow former with protrusions or a bend that goes deep into said resin former during a bonding process. CONSTITUTION:Protrusions 6 or a bent 7 is provided at a part of a lead where a lead frame 1 is insertedly supported by a hollow former. The protrusions 6 or the bend 7 goes into resin former during a melt-and-bond process, strengthening mechanical combination and increasing device reliability.
Inventors
- 👤 Hideo Inayoshi
- 👤 Kunihiko Nishi
- 👤 Hidetoshi Mochizuki
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 00:30
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
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