Mounting method and device for semiconductor pellet

Abstract

Abstract PURPOSE:To form a large scale matrix LED by dividing a pellet by scribing a semiconductor wafer, repeatedly transfer it to an adhesive sheet, arranging the pellets at the prescribed interval laterally and longitudinally, and simultaneously accurately mounting them. CONSTITUTION:A GaP wafer 21 is secured with wax 12 to a glass substrate, and is scribed. Then, the wax is molten, the wafer 21 is bonded to the first adhesive sheet 31, a releasable film 31 is coated, and is divided into longitudinal row pellets. Then, one row pellets 221 are transferred to the second adhesive sheet 32 and are divided. Thereafter, the divided LED pellet 222 are transferred to the third sheet 33, and are arranged in the prescribed interval. Then, the pellets 222 on the third sheet are contacted on the bottom surface via conductive paste 411 on the substrate 14, and silver paste 41 is coated thereon. Thereafter, a broke line 44 and a pellet fixing unit 43 are formed on the substrate 42, and the pellet 222 is contacted. In this manner, accurate mount can be simultaneously performed, thereby forming a large scale matrix substrate.

Inventors

• 👤 Osamu Ichikawa
• 👤 Tetsuo Sadamasa
• 👤 Tatsuro Beppu
• 👤 Kyozo Ide

Bibliographic Details