Device and method for developing

Abstract

Abstract PURPOSE:To economically perform a uniform developing having no dimensional irregularity by a method wherein a wafer placing stand having the diameter larger than that of a wafer, a frame body to be used for formation of a concaved section, which is deeper than the thickness of the wafer, and a device with which a developing solution is feeded are provided. CONSTITUTION:The wafer 11 is placed on the wafer placing stand 12, the frame body 16 comes down, the concaved section which is deeper than the wafer thickness is formed and the wfer 11 is develped by dripping the developing solution from a nozzle 15 and filling the solution in the concaved section. The developing solution is scattered by raising the frame body 16 and rotating the placing stand 12, and then the developing solution is completely removed by dripping a rinsing solution. Through these procedures wherein no pressure is applied to the surface of the substrate with resist on it, no irregularity of measurements in the developed pattern width is generated and also the quantity of the developing solution used can be reduced.

Inventors

• 👤 Kenzo Hatada

Bibliographic Details