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JPS5743422A Expired / Lapsed JP ⏱️ 0.0 years remaining

Resist coating apparatus

Assignee: Toshiba Corp
•
Filing: 1980-08-29
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Granted: —
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Expires: 2000-08-29
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Abstract

Abstract PURPOSE:To form a uniform resist layer by filling resist volatility suppressing solvent in a chamber in the state of preventing the volatilization of the solvent in the resist and coating the resist on the surface of a semiconductor wafer. CONSTITUTION:A chamber 10 is composed of a cylindrical chamber body 11 and a cover 12 so provided as to block the upper opening of the body. A vacuum chuck 13 is rotatably provided at the inner center of the body 11. The vacuum chuck 13 is maintained in reduced pressure state, and a semiconductor wafer 14 is attracted fixedly to the end. An annular solvent storage tank 15 is provided along the peripheral surface of the upper inner wall surface of the body 11. Accordingly, the interior of the chamber 10 is filled always with the resist volatility suppressing solvent 18 of predetermined density, thereby enabling the coating of the resist on the surface of the wafer 14.

Inventors

  • 👤 Kazuo Noda
  • 👤 Yoji Chokai

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 05:45
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/16; G03F7/162

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