Method and apparatus for soldering printed substrate

Abstract

Abstract PURPOSE: To always adjust the soldering condition of printed substrates to the most suitable condition, by soaking the substrate into a stationary solder bath, while the lowering condition of two lines of conveyor chains which are to be lowered toward the stationary solder bath by two pairs of movable chain rollers, is being adjusted. CONSTITUTION: Movable chain rollers 5a and 5b are at their highest position and a conveyor chain 3 which transfers a carrier 2 which holds a printed substrate 1, is positioned in parallel to a stationary molten solder bath S(a). When the carrier 2 approaches the bath S and turns on a limit switch installed in the course of its running way, rollers 5a and 5b are lower to locations so that they may proceed at an angle α(b). Then, the chain rollers 5a is lowered further after the soaking of the substrate 1 is started under a condition shown in the diagram b, the substrate 1 is positioned in parallel to the bath S as shown in the diagram c. When the substrate leaves the bath S, the chain roller 5b is lifted up first as shown in the diagram d, and then, the chain 3 leaves at an appropriate angle β. Subsequently, the chain rollers 5a and 5b return to the highest position and the chain 3 is positioned in parallel to the bath S as shown in the dagrams e and a. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Shin Okuyama

Bibliographic Details