Supporting structure for wafer

Abstract

Abstract PURPOSE:To facilitate the handling of a wafer supporting structure by extending a tape of strong bonding strength on a supporting jig and bonding a wafer through a tape of weak bonding strength on the upper surface of the tape, thereby enabling to support the wafer in a flat state even if a full dicing is executed. CONSTITUTION:A tape 5 of strong bonding strength is bonded to a semiconductor wafer supporting jig 4, and a wafer 1 is bonded through a tape 6 of weak bonding strength cut partly at the time of full dicing on the tape 5. In this manner, even if the wafer 1 is full diced, the flat state of the wafer 1 can be maintained, thereby performing the treatment of the later step. Thus, the wafer dicing can be fully automatized, and a breaking is eliminated, thereby preventing the crack and cutout or the like of a pellet.

Inventors

• 👤 Tsutomu Mimata

Bibliographic Details