Sealing method for semiconductor device

Abstract

Abstract PURPOSE:To perform mass production and cost reduction of sealing a semiconductor element by bonding another circuit resin substrate to a substrate which carries the element and sealing them. CONSTITUTION:A semiconductor element 21 is placed on a circuit resin substrate 21, a circuit resin substrate 23 coated with an adhesive 24 is placed on the substrate 21 an die bonded to the substrate, and is sealed. In this manner, the element can be sealed in a mass production and the cost is reduced.

Inventors

• 👤 Takao Mikawa

Bibliographic Details