Resin sealing device for semiconductor device

Abstract

Abstract PURPOSE:To reduce generation of defective products by a method wherein the direction of a semiconductor element and a lead frame is reversed to each other. CONSTITUTION:The semiconductor element 2 and the lead frame 1 are connected by a metal wire 3 and they are inserted in the cavity section of the lower metal mold 15 facing downward, the upper metal mold 14 is placed and then resin 16 is poured in. Through these procedures, the contact of the lead frame 1 with an island section and sticking of foreign substances on the surface of the semiconductor element can be prevented due to the sagging of the metal wire, thereby enabling to improve the production rate of nondefective products.

Inventors

• 👤 Naoto Kimura

Bibliographic Details