Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To achieve better adhesion of a sealing resin body and a heat sink and to improve dampproof by a method wherein the heat sink around a semiconductor pellet is provided with a through hole for restricting the sealing resin body. CONSTITUTION:A pellet 13 is connected to a radiating metal plate 11 which is provided with a through hole 15 through an adhesive layer 12 and the pellet is sealed by a sealing resin body 14 so that the pellet may be buried. The sealing resin body 14 is mechanically restricted by the through hole 15 provided at the radiating metal plate 11 around the pellet 13. In this way, adhesion becomes good and dampproof is improved and the slip of the resin body by heat stress is eliminated to prevent the crack of the pellet.

Inventors

• 👤 Satoru Suzuki

Bibliographic Details