Semiconductor device

Abstract

Abstract PURPOSE:To enhance IC package density by a method wherein a semiconductor contains a terminal resistor in an electrically cut off condition and said resistor is made electrically communicable when necessary by a prescribed amperage or voltage applied from outside. CONSTITUTION:The output terminal 1 of a power transistor Q1 is connected to a terminal resistor R and a circuit 2 through a connecting device Q2. Th circuit 2 consists of a Zener diode Q3, a transistor Q4, and others. The output terminal 1 and the terminal resistor R are not electrically communicable under said conditions. When a need arises for the output terminal 1 to become electrically communicable with the terminal resistor R, an external power source is employed to apply a prescribed amperage or voltage to the output terminal 1, which establishes an electric communication with the Zener diode Q3 and the transistor Q4. As the result, a large capacity current is forced through the connecting device Q2 by destroying the emitter/base connection in the device Q2. This transforms the device Q2 into a mere diode electrically communicating output terminal 1 to the resistor R. Need for the connection of an external terminal resistor R is thus eliminated.

Inventors

• 👤 Yoshio Watabe
• 👤 Masayuki Komon

Bibliographic Details