Curing agent for epoxy resin

Abstract

Abstract NEW MATERIAL:A compound of formula I, wherein R is H, amino, carboxyl or a monovalent group containing an aromatic or heterocyclic ring which can contain halogen substitutents, R' and R" are each H or an alkyl, (a) and (b) are such numbers that, when a=1, b=1, and when a=2, b=0, and when a=2, the two moieties in the parenthesis can be different from each other, and the phenol uncleus in the parenthesis can have substituents such as an alkyl, OH or a halogen. USE: Highly heat-resistant epoxy resin cured products, for example, used for the production of printed circuit boards. If combined with poly-p-vinylphenol and/or its halogenated product, an epoxy resin cured product excellent in both heat resistance and moisture resistance can be obtained. PREPARATION: A compound of formula IV is obtained by mixing a compound of formula II with a compound of formula III at a predetermined ratio, stirring the mixture and subjecting the mixture to a melt addition reaction. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Masahiro Matsumura
• 👤 Masaaki Otsu
• 👤 Yoshihiro Kitsuta

Bibliographic Details