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JPS57122A Expired / Lapsed JP ⏱️ 0.0 years remaining

Curable resin composition

Assignee: Mitsubishi Electric Corp
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Filing: 1980-05-30
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Granted: —
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Expires: 2000-05-30
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Abstract

Abstract PURPOSE: Titled composition which can be completely cured by irradiating with light or a radiation and heating, comprising an epoxy resin, a polyfunctional carboxylic acid anhydride, a compound which , when irradiated with a radiation or light, generates a Lewis acid, and a quat. ammonium salt of a Lewis acid. CONSTITUTION: A curable resin composition comprising (A) an epoxy resin containing at least two epoxy groups in the molecule, (B) a polyfunctional carboxylic acid anhydride copolymerizable with resin A, e.g., methyltetrahydrophthalic anhydride, (C) a compound which, when irradiated with light or a radiation, generates a Lewis acid, e.g., diaryliodonium salt of a Lewis acid of formula I, wherein M is a transition metal, B, P, As or the like, X is a halogen, n and m are integers, R 1 and R 2 are each nitro, OH, aryl or the like, and (D) a quat. ammonium salt of a Lewis acid, e.g., compound of formula II, wherein M, X, m and n are as defined above, and Z 1 WZ 4 are each an alkyl, a halogen, phenyl or the like. As it is cured by irradiation with light or a radiation, the resin composition does not exude during heat curing and forms sag- or void-free products. COPYRIGHT: (C)1982,JPO&Japio

Inventors

  • 👤 Makoto Tsunoda
  • 👤 Yasuhiro Suzuki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 13:49
CPC Classifications
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