Low melting point hard solder material

Abstract

Abstract PURPOSE:A low melting point hard solder material of good wettability and superior mechanical properties obtained by adding the specific amounts of tin and nickel to a copper-phosphorus-silver 3-element alloy. CONSTITUTION:A low melting point hard solder material composed of 10-30wt% silver, 2.5-6% phosphorus, 9-20% tin, <=3% nickel and copper and unavoidable impurities for the remainder. In this composition are preferably made 11-20% tin and 0.05-3% nickel. This solder material has a low melting point, has self-meltability in atmosphere, good in wettability and penetrating characteristic and is superior in mechanical strength. Hence, it becomes possible to perform step brazing of copper or copper alloy in the atmosphere without using any solvent with good workability and reliability.

Inventors

• 👤 Takashi Fukumaki
• 👤 Tomiro Yasuda

Bibliographic Details