Manufacture of projection for substrate conductor layer

Abstract

Abstract PURPOSE:To obtain a stable pattern of a semiconductor element even if the resist on the surface thereof is isolated by conducting twice coating of the resist and isolating thereof when forming a projection made of a conductive layer for electrically connecting with the semiconductor element on a tape carrier. CONSTITUTION:Conductor layers 20 are coated and etched on a region of an insulating tape carrier 1 provided with conveying sprocket holes 5 at both side edges to form a connecting terminal 22 as below. That is, a conductor layer 20 made of copper foil or the like is initially coated on the respective regions of the carrier 1, resist layers 4 of predetermined pattern are formed by utilizing the protective resist layer 61 on the surface thereof and the openings of the carrier 1 on the back surface thereof, are etched to form a projection 21 only on the back surface of the layer 20. Thereafter, the layer 61 is removed, a pattern of the resist layer 31 is formed corresponding to the position of the projection 21 newly, the portion excent the terminal for connection including the projection 21 is etched, and the opening of the carrier 1 is then buried with the protective resist layer 60.

Inventors

• 👤 Kazuyoshi Haniwara

Bibliographic Details