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JPS568451A Expired / Lapsed JP ⏱️ 0.0 years remaining

Molding polyamide resin composition

Assignee: Toyobo Co Ltd
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Filing: 1979-06-29
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Granted: —
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Expires: 1999-06-29
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Abstract

Abstract PURPOSE:To provide titled compsn. which produces a molded article having good smoothness and surface gloss and excellent adhesion to acrylic paints, containing a polyamide resin, a solid inorg. filler and a saponified product of an alpha-olefin-vinyl ester copolymer. CONSTITUTION:There is provided a compsn containing a polyamide, 10-60wt% (based on the weight of the compsn.) of a solid inorg., filler having an average particle diameter of not more than 15mu and 1-15wt% (based on the weight of the compsn.) of a saponified product of an alpha-olenin-vinyl ester copolymer. Examples of the saponified products of the alpha-olefin-vinyl ester copolymers are saponified products of alpha-olefin-mocarboxylic acid vinyl ester copolymers having a saponification degree of not less than 90mol%, particularly pref. a saponified product of an ethylene-vinyl acetate copolymer. It is preferred to blend 0.2-2wt% of a coupling agent e.g. a silane coupling agent or/and a titanate coupling agent in order to improve adhesion of the resin to the solid inorg. filler.

Inventors

  • 👤 Hiroshi Imanaka
  • 👤 Yoshihiko Kijima

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-24 13:46
CPC Classifications
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