Manufacture device of semiconductor

Abstract

Abstract PURPOSE:To improve the flatness of semiconductor wafer attracted to a chuck by permitting the independent control of chuck suction holes or sucking grooves attracting the semiconductor wafer for each wafer part. CONSTITUTION:A control system 7 of the suction holes 6 attracting the wafer at the central part in a chuck 5 and the control system 9 of the suction holes 8 attracting the wafer at the outer side part in the chuck 5 are independent each other. The wafer warped like a potato chip are placed on the chuck 5. Firstly, the wafer are attracted through the suction holes 6 at the central part. In this case, gas sucked through the suction holes 6 can be ejected from the holes 8. Then, the wafer at an external peripheral part are attracted by the suction holes 8. In this way, the wafer is attracted to the chuck by starting the suction from the central part and by finally transferring to th external pheripheral part. Therefore, the flatness of the attracted wafer will be improved.

Inventors

• 👤 Junichi Hoshi

Bibliographic Details