Manufacture of electronic circuit mounting device

Abstract

Abstract PURPOSE:To eliminate a difficulty based due to a heat treatment by bonding an electronic part to an insulating substrate using ultraviolet curable resin. CONSTITUTION:An adhesive layer 22 is coated on one surface of a resin film substrate 21 passing ultraviolet rays such as a polyester, and a metallic frame 23 having a window 24 to which an electronic part is inserted is bonded thereto. After then positioning, a through hole 25 is opened at the substrate 21, ultraviolet curable resin is coated on the entire surface of the bonded side of the frame 23, the electronic part 30 is inserted into the window 24, and is positioned. Thereafter, ultraviolet rays 26 are irradiated from the opposite side, thereby curing the resin 28, and the resin 27 not cured is removed by cleaning. Then, the part of the resin 28 is removed by etching, aluminum is further evaporated in a wiring pattern, thereby forming the wire. Thus, heat is eliminated, thereby turning inexpensive resin film into serviceable state and eliminating the accident of wire disconnection due to thermal stress.

Inventors

• 👤 Isamu Kitahiro
• 👤 Kazufumi Ogawa

Bibliographic Details