Manufacture of semiconductor integrated circuit
Abstract
Abstract PURPOSE:To increase efficiency of utilization of a wafer by a method wherein an IC chip having a larger area is provided in the center of an Si single crystal wafer and at the same time a small-chip-sized IC is formed on the peripheral section of the IC chip. CONSTITUTION:Using a mask whereon an IC pattern 9 with a large chip size is arranged in the cente of a glass substrate 8 and an IC pattern 10 with a small chip size is arranged on the surrounding region, IC patterns 6 and 7 having a different chip size are formed on an Si substrate 5 simultaneously. With this constitution, a wafer is utilized effectively and the cost of the chips can be cut down.
Inventors
- 👤 Koichi Oguchi
Bibliographic Details
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