Curable resin composition

Abstract

Abstract PURPOSE: The titled composition useful for coating electrical parts, etc., causing no crack in curing, comprising a curable compound having an unsaturated group, a butadiene-acrylonitrile copolymer having terminal carboxyl groups, a photosensitizer, and an initiator for thermal curing. CONSTITUTION: (A) A curable compound (e.g., ethylene glycol diacrylate, etc.) having an ehtylenic unsaturated groups is blended with (B) 10W40wt% based on ingredient A butadiene-acrylonitrile copolymer having terminal carboxyl group, (C) a photosensitizer (e.g., benzophenone, etc.) and (D) an initiator for thermal curing (e.g., methylethylketone peroxide, etc.) as essential ingredients, to give the desired composition. The resin composition is applied to a copper wire which is previously coated with enamel and can be cured by using light energy and thermal energy. COPYRIGHT: (C)1981,JPO&Japio

Inventors

• 👤 Osamu Ogitani
• 👤 Rihei Nagase
• 👤 Kotaro Nagasawa

Bibliographic Details