Semiconductor device

Abstract

Abstract PURPOSE:To enable cleansing of a flux by a method wherein a metallized part of the bottom surface of a ceramic carrier is projected and thereby an aperture is made between the bottom surface with no metallized layer and a substrate. CONSTITUTION:The outer edge of the bottom surface of the carrier continuing to an outside lead 14 is formed into a projection 22. The metallized part 18 is formed in extension on the lower surface of the projection. Moreover, in the projection 22 are provided passing grooves 23 for cleansing liquid at the time of cleansing of the flux. When the metallized part 18 is soldered to the wiring 20 of the substrate 19 in this constitution, a large aperture l2 is produced between a nonmetallized part 11a and the surface of the substrate 19, while the outside and inside are communicated with each other through the grooves 23. Accordingly, the cleansing liquid is made to pass inside the aperture l2 through the grooves 23 after soldering, whereby the flux can be cleansed effectively. By this the erosion of the lead is prevented and the reliability and durability of the device is improved.

Inventors

• 👤 Shunji Koike

Bibliographic Details