Mounting method for pressure-sensor assembly

Abstract

Abstract PURPOSE:To make the device small-sized and increase the reliability thereof by a method wherein the pressure-sensor assembly is arranged on the side of a substrate of ceramics whereon a thick- film conductor is not formed and the electrode of the sensor is connected with the thick-film conductor by solder through the intermediary of the hole made in the substrate. CONSTITUTION:The pressure-sensor assembly wherein a silicone member 4 formed of a semiconductor strain gage 2 and the electrode 3 provided at one end of the gage 2 is bonded on to a diaphragm 1 is prepared on a glass member 6 with a hole 5 for introducing the pressure to be measured in the center thereof. This assembly is arranged in a concavity 20 formed in the substrate 7 of ceramics, the solder 11 is put on the hole 10 of the substrate 7 and the thick-film conductor 8 on the substrate 7 is connected with the electrode 3, whereby the assembly is fixed to the substrate 7. Next, the substrate 7 and the glass member 6 of the assembly are bonded to a case 13 by a bonding agent 14, an IC amplifier 9, the conductor 8 and the member 4 are covered with a gel-like substance 18 whose modulus of rigidity is small and which has humidity-proof properties, then a cover plate 15 is bonded and thus the pressure sensor 100 is completed. In this way, the part wherein the electrode 3 is joined to the conductor 8 by the solder 11 is constituted so as not to be overstrained by the pressure to be measured, vibrations and the change in the temperature.

Inventors

• 👤 Kiyomitsu Suzuki
• 👤 Kazuji Yamada
• 👤 Motohisa Nishihara
• 👤 Shigeyuki Kobori

Bibliographic Details