Preparation of semiconductor-supporting electrode

Abstract

Abstract PURPOSE:To obtain a semiconductor-supporting electrode having small and uniform thermal expansion coefficient by alternately piling a composite material of Cu and spiral C fibers and Cu plates to form one body so that the disorder of the fibers in the lateral and longitudinal directions can be prevented. CONSTITUTION:When the C in a Cu-C fiber is made above 50vol%, a bundle of the fibers can have a fairly even Cu plated layer, and therefore the bundle can be coiled uniformly, so that the undulation of the C fibers is prevented. Moreover, hot- pressing several coiled Cu-C fibers sandwiching Cu plates permits the Cu plates to prevent the deformation of the fibers. Consequently, the contraction coefficient decreases, and also the longitudinal disorder of the fibers largely reduces. In addition, the electrical conductivity can be adjusted by increasing or decreasing the volume of the Cu. The constitution permits an electrode having a uniform thermal expansion coefficient to be formed at a large yield.

Inventors

• 👤 Hitoshi Onuki
• 👤 Noboru Baba
• 👤 Hiroshi Soeno
• 👤 Keiichi Kuniya
• 👤 Hideo Arakawa
• 👤 Takuzo Ogawa

Bibliographic Details