Packaging method for semiconductor device

Abstract

Abstract PURPOSE:To securely prevent a short-circuit and to obtain a sealed body of higher reliability by providing fused resin between the connections of a semiconductor device, and hardening the resin to secure the connections before transfer-molding. CONSTITUTION:On a semiconductor device 10 which has not been sealed, a lump of unhardened solid epoxy resin 16 is placed and fused in an oven before being cooled to secure connections 13 in the resin 16. Then transfer-molding this prevents the short-circuit of the connections when resin is injected under a high pressure. Setting the outer resin 17 to be of excellent moisture resistance and the thermal expansion coefficient of the inner resin 16 to be the almost same as the connections prevents also the production of cracks. Thus, a sealed body of higher reliability is obtained.

Inventors

• 👤 Hideo Inayoshi
• 👤 Yoshiaki Wakashima
• 👤 Kunihiko Nishi

Bibliographic Details