Etching method

Abstract

Abstract PURPOSE:To accurately etch to a desired depth by providing a monitoring material having the same thickness as a desired etching depth to etch simultaneously. CONSTITUTION:A bath 12 is filled with an etching liquid 11, and a wafer 14 to be etched and a monitor chip 15 are attached to a holder 13. The monitor chip 15 is made of the same material as the wafer 14, and has a thickness d equal to the etching depth of the wafer 14. When the thickness d of the chip 15 has been etched, a groove having the desired depth d is formed in the wafer 14. The wafer 14 and the chip 15 are under completely same conditions of the liquid temperature and stirring state. Therefore, pulling up the holder 13 when the monitor chip 15 had disappeared permits a groove having an extremely accurate depth to be formed in the wafer 14.

Inventors

• 👤 Yutaka Misawa
• 👤 Masaaki Takahashi
• 👤 Komei Yatsuno

Bibliographic Details