Airtight container with light transmission opening

Abstract

Abstract PURPOSE:To avoid the decrease is light transmission performance of an airtight container with a light transmission opening without coating a low melting point glass directly on when opening by interposing a ring-like spacer coated with a low melting point glass therebetween the securing a semiconductor element for emitting a light and for receiving a light on a substrate and forming the opening at an interval thereon. CONSTITUTION:A photosemiconductor 8 is secured to the central portion on a planar ceramic substrate 4 formed with a metallized wire 6 on the periphery thereof while exposing the central portion thereof with an low melting point solder such as an AuSi or the like or Ag paste. Then, electrodes fromed thereon are connected through fine wires made of Au, Al or the like to the wire 6, and external lead wires 7 are led from the wires 6. When a planar light transmission opening 5 made of glass, saphhire, quarts or the like is confronted thereafter with the photosemiconductor 8, a ring-shaped ceramic support 8 having low metling point glass-coated layers 2, 3 on each of both the front surface and the back surface of a circular or rectangular shape is fixedly disposed between the wire 6 and the opening 5.

Inventors

• 👤 Masato Nakajima
• 👤 Akira Ishida

Bibliographic Details