Method and apparatus for taping semiconductor device

Abstract

Abstract PURPOSE:To improve the working efficiency and the accuracy by setting a lead frame and a tape at the same position and taping simultaneously with cutting of the lead frame. CONSTITUTION:A lead frame 11 is set on a die 10 of a mold and the frame 11 is cut and separated by a punch 3. Before the cutting, the lead frame is specified in its position by positioning grooves 7 in a rod 4 and attracted by the action of vacuum. The rod 4 is pushed down simultaneously with the cutting of the lead frame to be descended while holding a separated part 17. Then, the part 17 is adhered on a tape 13 laid upon a drum 12. The rod and the punch ascend together with an upper mold, while the tape 18 and the lead frame on the die 10 are moved by one step. According this arrangement, the taping work is carried out simultaneously with the cutting of the lead frame, so that the process for transfer is eliminated and the accuracy of taping position is improved.

Inventors

• 👤 Yasuhiro Koyama
• 👤 Kazuaki Okamoto

Bibliographic Details