Semiconductor device

Abstract

Abstract PURPOSE:To improve the reliaility of the device by connecting the inner end of a lead wire in the hole of a dielectric substrate having a through-hole to the electrode of a semiconductor, and the outer end thereof to the conductive pattern of the insulated substrate to prevent the flow of a sealing resin by the dielectric substrate. CONSTITUTION:The inner end 25' of a lead wire is connected to the electrode of a semiconductor element 23 within the through hole 28 of a resin substrate 26, and the outer end 25'' is allowed to correspond to a conductive pattern 22 on a ceramic substrate 21. Then, an element 23 and a base material 26 are bonded 24 and 24' to the substrate 21. Then, a lead end 25'' is connected to the pattern 22, and a sealing resin 27 is placed in the hole 28 of the substrate 26. According to this method, the assembly sealing can be performed stably and easily, and the lead 25 is stabilized strengthwise and the thinning of the device becomes easy.

Inventors

• 👤 Toshio Kasuga

Bibliographic Details