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JPS5630735A Expired / Lapsed JP ⏱️ 0.0 years remaining

Wire-bonding device

Assignee: NEC Corp
•
Filing: 1979-08-21
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Granted: —
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Expires: 1999-08-21
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Abstract

Abstract PURPOSE:To make it possible to spontaneously control the locus of a capillary and a bonding pressure by a method wherein currents in a moving coil provided at an end of a swing-arm are controlled while identifying a position and speed of the swing- arm. CONSTITUTION:The swing-arm 1 is provided swingablly around a shaft 2 as arrowed. The capillary 3 is fitted at one end of the arm 1 and a moving coil 4 on the other end. The coil 4 is provided in a space of a magnetic circuit 5, the arm 1 is driven by flowing currents in the coil 4, and the position and speed of the arm 1 are respectively detected by a position detecter 6 and a speed detecter 7. Free changes in the operations for controlling the elevation of the capillary 3 can be carried out in high degree by controlling the currents flowing in the coil 4, while identifying signals from the detecters 6 and 7, and also the bonding pressure can easily be controlled by the currents flowing through the coil 4.

Inventors

  • 👤 Osamu Nakayama

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 21:35
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07173

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS521435A Cited
JPS5214352A Cited
JPS52143946A Cited

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