Manufacture of photomask

Abstract

Abstract PURPOSE:To simplify a photomask manufacturing process and increase the accuracy of the photomask by exposing a radiation sensitive org. resist film, to electron beams, which is opaque to ultraviolet rays or far ultraviolet rays. CONSTITUTION:Radiation sensitive org. resist film 3A which is opaque to ultraviolet rays or far ultraviolet rays is directly formed on substrate 1, and a desired pattern is formed in film 3A by exposure to electron beams, development and post- baking. Using the residual portion of film 3A as a light shielding portion, pattern printing is carried out with ultraviolet rays or far ultraviolet rays. Thus, the formation of a light shielding film, the etching of the film and the removal of the residual resist film are made unnecessary as compared to a conventional method, resulting in a simplified process.

Inventors

• 👤 Koichiro Ootori

Bibliographic Details