Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To enable to control precisely the opening condition of an opening part of a semiconductor device when a minute opening part is to be formed in an insulating film provided on the semiconductor substrate by a method wherein an opening part for monitoring to afford the standard of judgement with regard to the etching condition is provided to judge visually the etching condition. CONSTITUTION:When a chip region 5 and a scribe grid part 15 are provided in a semiconductor substrate, and for example, an opening part is to be provided in a region 10 on the chip region 5 by etching an SiO2, masks 31 are formed on the parts excepting the region 10 and a monitor region 16 on the scribe grid part 15 to perform an etching process. The finishing time of etching is confirmed by detecting the changing state of surface condition of the opening part 16 from hydrophilic to hydrophobic. By forming the monitor opening part 16 by the process mentioned above having enough magnitude being able to confirm visually, although the opening part to be provided in the chip region 5 is too minute to be visual, the etching condition can be grasped precisely, so that the etching condition of the opening part can easily be controlled.

Inventors

• 👤 Shuji Kondo
• 👤 Kazuhiko Tsuji

Bibliographic Details