Solid state color image sensor chip

Abstract

Abstract PURPOSE:To improve color separation characteristic by a method wherein a non- Al opaque film is formed on a insensitive region of each picture element on an incident surface of an image sensor chip, and each colored filter is provided on each sensitive region which is surrounded by insensitive region to have an overlaped ends with the non-Al opaque film. CONSTITUTION:Plural number of insensitive regions 22, 23 which act as isolation regions for separation of each picture element is formed on the surface of an Si substrate 21, and transfering electrodes 25 are provided all over the surface of it to have an oxide film 24 between them. Next they are covered with a passivation film 26, and a solid state image sensing element is fabricated by providing colored filters 3R, 3G, 3B in order corresponding to sensitive regions which is surrounded by insensitive regions 22, 23 etc. According to this constitution on the film 26 which act as boundary regions of filters and is placed corresponding to insensitive region 22, 23, a non-Al opaque film 28 which comprises of an organic high polymer film such as gelatin or casein or a metal thin film of Cr, Zr etc. is provided, and sides of each filter 3R, 3G, 3B are formed to have an extending region over and to have a contact with these filmes 28.

Inventors

• 👤 Akira Okazaki
• 👤 Norihiko Tsukui

Bibliographic Details