Removal and reinstallation of silicon chip

Abstract

Abstract PURPOSE:To perform the installation and removal of silicon chip without using preheating means by a method wherein a heat ray for the installation and removal of chip is utilized effectively for the preheating of a substrate. CONSTITUTION:A shielding plate 4A has an opening hole at an appointed place having a taper in the direction of a heat source. The shielding plate is constituted by laminating an Au thin film 10 and a protective film 11 like glass, etc., on the chip side of a quartz plate 9. At the place except the installing and removing part of chip, about 10% of heat ray is absorbed by the quartz plate to contribute to the temperature rise, and about 30% of heat ray is reflected 2 to contribute to the temperature rise of a chip to be installed and removed. The remained 60% of heat ray contributes to the preheating of a substrate 7 passing through the shielding plate 4A. When the chip to be installed and removed is heated to the temperature of 350 deg.C by an infrared rays lamp, the temperature of part of substrate 7 surrounding the chip is made to so rise to 150 deg.C as to make the hot plate for preheating to be needless. By this way, the temperature of chip necessary for the installation and removal can be made to arise in the same irradiating time.

Inventors

• 👤 Tasao Soga
• 👤 Tomiro Yasuda
• 👤 Kazuya Takahashi
• 👤 Akihiro Kenmochi

Bibliographic Details