JPS5624958A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Lead frame for semiconductor device
Assignee: NEC Kyushu Ltd
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Filing: 1979-08-07
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Granted: —
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Expires: 1999-08-07
Abstract
Abstract PURPOSE:To prevent a coupling wire from making contact with the end of a semiconductor element by providing an insulator frame around the periphery of a semiconductor element fixing portion. CONSTITUTION:The insulator frame 5 is formed on the periphery of a semiconductor fixing portion 1 of a lead frame. Thus, a coupling wire 4 may not shortcircuit with the end of the semiconductor element not with the end of the fixing portion, thereby improving the workability.
Inventors
- 👤 Hiroshi Kubo
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 22:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/581; H10W90/00; H10W90/701; H10W90/751; H10W90/756
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